Khammour, F. and Ainane, A. and Elmatar, M. and Kenz, A. and Elkouali, M.H. and Talbi, M. and Ainane, T. (2018) Effect of waste mint in urea formaldehyde adhesive on the thermal degradation of plywood. Oriental Journal of Chemistry, 34 (3). pp. 1375-1379.

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In this article, the plywood panel using a new adhesive formulation of urea formaldehyde resin is evaluated to study the effect of waste mint on the thermal behavior of plywood.The adhesive formulation was loaded by a percentage of waste mint. According to TGA and DSC results obtained by thermogravimetry and differential scanning calorimetry methods, the decomposition temperature of the above mentioned plywood panel (P-WM) is slightly higher compared to the reference plywood (P-REF).The results also show that plywood panel (P-WM) has better thermal stability characteristics than plywood panel (P-REF). The plywood panel increases the enthalpy of degradation according to DSC results. © Oriental Scientific Publishing Company. All rights reserved.

Item Type: Article
Subjects: Biochemistry, Genetics and Molecular Biology
Divisions: SCIENTIFIC PRODUCTION > Biochemistry, Genetics and Molecular Biology
Depositing User: Administrateur Eprints Administrateur Eprints
Last Modified: 31 Jan 2020 15:44

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